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General Purpose Relays
Industrial Relays
KUIP/KUGP Series Panel Plug-in Relay (Continued)
Potter & Brumfield
Other Data
Material compliance: EU RoHS/ELV, China RoHS, REACH, Halogen content
refer to the Product Compliance Support Center at
Ambient temperature
DC coil KUIP: -45oC to 95oC
KUGP: -45oC to 75oC (1 & 2 pole)
AC coil KUIP: -45oC to 70oC
KUGP: -45oC to 70oC (1 & 2 pole)
Category of environmental protection
IEC 61810 RTI - dust protected
Terminal type Quick connects (QC) .187
PCB-THT
Terminal retention, push force 25 lbs for 3s
Weight 85g
Packaging/unit tray/25 pcs., box/150pcs.
Dimensions
Plain case
Accessories
For details see datasheet Sockets and Accessories, KUP Relays
Product Code Description
27E893 DIN socket (use 20C318 clip)
27E121 Track mount socket (use 20C314 clips)
27E043 Chassis mount/solder eyelet socket (use 20C254 clip)
27E046 Chassis mount/PCB socket (use 20C254 clip)
27E067 Chassis mount/quick connect socket (use 20C254 clip)
27E396 Snap-in/quick connect socket (use 20C254 clip)
Bracket mount case
.625 TYP.
(15.88)
.312
TYP.
(7.92)
2.90 MAX.
(73.7)
X
.078 R. TYP.
(1.98)
1.906 MAX.
(48.41)
X
1.531 MAX.
(38.89)
.75
(19.1)
X
X
X
.375
(9.53)
2.500
(63.50)
X X
.437
(11.10)
1.531 MAX.
(38.89)
A
1
4
7
2
5
8
3
6
9
B
1.406 MAX.
(35.71)
1.406 MAX.
(35.71)
.07
(1.8)
1.906 MAX.
(48.41)
.06
(1.52)
Top flange case
PCB layout
Bottom view on solder pins
1.518 MAX.
(38.56)
.078 TYP.
(1.98)
3 Form C shown
Omit unncessary holes for other contact forms
(34.87 ± .25)
A
1
4
7
2
5
8
3
6
9
B
1.713 ± .0 03
(43.51 ± .08)
1.373 ± .010 1.989 ± .0 03
(50.52)
.076 DIA. TYP.
(1.93)
.206
(5.23)
.178 TYP.
(4.52)
X Is For Terminal Dimensions.
See Teminal Drawings.
2.248 MAX.
(57.10)
.437
(11.10)
.875
(22.23)
.328
(8.33) .626
(15.90)
2
08-2011, Rev. 0811
? 2011 Tyco Electronics Corporation,
a TE Connectivity Ltd. company
Datasheets and product specification
according to IEC 61810-1 and to be used
only together with the ‘Definitions’ section.
Datasheets and product data is subject to the
terms of the disclaimer and all chapters of
the ‘Definitions’ section, available at
Datasheets, product data, ‘Definitions’ sec-
tion, application notes and all specifications
are subject to change.
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